Widely used in touch screen circuits and BM printing, ceramic capacitors, resistors, thick film circuits, ceramic circuits, filters, glass glaze potentiometers, dielectric antennas, ceramic metallization, RFID, sensors (piezoresistive, capacitive) integrated LED lamp holders, piezoelectric ceramic components, LED ceramic substrates, LTCC, MLCC, filters, ceramic thick film circuits, solar silicon wafers, chip components and electronic component printing process manufacturing. (It can realize buried hole printing and through hole printing)