Introduction to the production process of powder printing on ceramic substrates

Powder coating printing on ceramic substrates is a key step in the high-precision thick film printing process. It is widely used in electronic components, LED packaging, sensors, power electronic devices and other fields. The high precision and high reliability of thick film printing technology make it play an important role in the field of microelectronics. This article will introduce the production process, industry pain points and equipment selection of powder coating printing on ceramic substrates in detail.

I. Process

The production process of powder printing on ceramic substrates mainly includes the following steps:

1. Substrate cleaning

Before powder coating printing, the surface of the ceramic substrate must be thoroughly cleaned. A clean substrate can remove impurities, oil stains and dust on the surface to ensure that the powder can be evenly attached. Common cleaning methods include ultrasonic cleaning, chemical cleaning and high-pressure airflow cleaning.

2. Preparation for powder application

The powder coating used in high-precision thick film printing is usually composed of ceramic powder, glass powder and other metal powders, which are carefully screened and mixed to ensure that the powder particles are uniform and have a suitable particle size distribution. This step is crucial to the quality of the powder coating, because the quality of the powder directly affects the printing quality and the subsequent sintering effect.

3. Silk screen plate making

In order to transfer the powder coating evenly onto the ceramic substrate, a screen is required. The preparation of the screen needs to be carefully designed according to the parameters such as the required pattern accuracy, powder particle size and mesh size to ensure accurate replication of the pattern details.

4. Printing operation

On the screen printer, the ceramic substrate is placed on the printing platform, and the powder is pressed from the screen plate by a scraper and evenly transferred to the substrate surface. This process requires high-precision control of the scraper pressure, printing speed and film thickness to ensure the uniformity and accuracy of the powder layer.

5. Sintering and curing

After printing, the substrate enters the sintering furnace for high-temperature curing. The sintering process requires strict control of the temperature curve to ensure that the powder is well bonded to the substrate and to obtain the required electrical and mechanical properties. The sintering temperature is usually between 800°C and 1000°C, and the specific temperature and time depend on the composition of the powder and the process requirements.

6. Detection and post- processing

After sintering, the ceramic substrate needs to be tested for dimensional accuracy, electrical properties, etc. If it fails to meet the standards, it may need to be repaired or reprocessed. Post-processing steps include surface finishing, cutting, marking, etc.

II. Industry Pain Pointss

Although the ceramic substrate powder printing process is widely used in electronic manufacturing, there are still some industry pain points, mainly including the following:

1. Accuracy and consistency control

In high-precision thick film printing, ensuring the consistency and accuracy of the powder coating is one of the biggest challenges. Due to changes in factors such as powder particle size, viscosity, and humidity, problems such as uneven thickness and pattern distortion may occur during the printing process, affecting the quality of the final product.

2. High equipment performance requirements

High-precision printing places extremely high demands on equipment, especially in terms of scraper control, printing speed adjustment, substrate fixing, etc. The accuracy, stability and degree of automation of the equipment directly affect production efficiency and product quality.

3

. Controllability of sintering process

Sintering is a complex heat treatment process, and the temperature and time need to be controlled precisely. Even small fluctuations can cause quality problems in the powder coating, affecting the final electrical and mechanical properties.

4. Production efficiency and cost issues

The high-precision thick film printing process has strict requirements, resulting in long production cycles and high costs. As the market demand for low-cost and efficient production increases, how to improve production efficiency while ensuring quality has become a major challenge for the industry.

III. Equipment Selection

The selection of equipment for powder coating printing of ceramic substrates is crucial. The right equipment can not only improve production efficiency but also ensure product quality. The main equipment selection criteria include:

1. Screen printing machine

Choosing a high-precision screen printer is the basis for achieving high-quality powder printing. Modern screen printers are usually equipped with a sophisticated scraper control system and an automatic adjustment system, which can accurately control the printing pressure, speed and film thickness. At the same time, the degree of automation of the equipment can also effectively improve production efficiency.

2. Sintering furnace

The selection of the sintering furnace needs to be customized according to the size of the ceramic substrate, the complexity of the printed pattern and the characteristics of the powder coating used. The multi-stage temperature-controlled sintering furnace can accurately control the temperature curve during the sintering process to ensure a strong bond between the powder coating and the substrate.

3. Powder supply system

The accuracy of the powder supply system directly affects the stability of printing. An efficient powder supply system can ensure uniform supply of powder and avoid blockage or unevenness.

IV. Future Development Trends and Challenges